产品编号: 440670401 Micro-Fit 3.0 连接器系统产品系列 MOLEX
产品编号: 440670401
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 4 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-0401
状态: Active
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产品编号: 440670402
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 4 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-0402
状态: Active
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产品编号: 440670403
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 4 Circuits, 0.76µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-0403
状态: Active
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产品编号: 440670601
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-0601
状态: Active
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产品编号: 440670602
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-0602
状态: Active
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产品编号: 440670603
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, 0.76µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-0603
状态: Active
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产品编号: 440670801
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-0801
状态: Active
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产品编号: 440670802
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-0802
状态: Active
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产品编号: 440671001
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-1001
状态: Active
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产品编号: 440671002
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1002
状态: Active
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产品编号: 440671003
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, 0.76µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1003
状态: Active
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产品编号: 440671201
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 12 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-1201
状态: Active
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产品编号: 440671202
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 12 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1202
状态: Active
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产品编号: 440671203
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 12 Circuits, 0.76µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1203
状态: Active
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产品编号: 440671401
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-1401
状态: Active
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产品编号: 440671402
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1402
状态: Active
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产品编号: 440671403
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, 0.76µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1403
状态: Active
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产品编号: 440671601
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, Tin (Sn) Plating
Engineering/Old PN: 44067-1601
状态: Active
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产品编号: 440671602
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, 0.38µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1602
状态: Active
总览: Micro-Fit 3.0 Connector System Product Family
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产品编号: 440671603
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, 0.76µm Gold (Au) Selective Plating
Engineering/Old PN: 44067-1603
状态: Active
总览: Micro-Fit 3.0 Connector System Product Family
