产品编号: 462070024 Mini-Fit 产品家族电源连接器MOLEX原装进口
产品编号: 462070024
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0024
状态: Active
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产品编号: 462070104
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 4 Circuits, 2.36mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0104
状态: Active
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产品编号: 462070106
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 6 Circuits, 2.36mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0106
状态: Active
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产品编号: 462070108
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 8 Circuits, 2.36mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0108
状态: Active
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产品编号: 462070110
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 10 Circuits, 2.36mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0110
状态: Active
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产品编号: 462070112
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 12 Circuits, 2.36mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0112
状态: Active
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产品编号: 462070124
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 24 Circuits, 2.36mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0124
状态: Active
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产品编号: 462070204
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 4 Circuits, 3.18mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0204
状态: Active
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产品编号: 462070206
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 6 Circuits, 3.18mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0206
状态: Active
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产品编号: 462070208
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 8 Circuits, 3.18mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0208
状态: Active
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产品编号: 462070210
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 10 Circuits, 3.18mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0210
状态: Active
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产品编号: 462070212
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 12 Circuits, 3.18mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0212
状态: Active
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产品编号: 462070224
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 24 Circuits, 3.18mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-0224
状态: Active
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产品编号: 462071004
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 4 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1004
状态: Active
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产品编号: 462071006
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 6 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1006
状态: Active
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产品编号: 462071008
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 8 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1008
状态: Active
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产品编号: 462071010
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1010
状态: Active
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产品编号: 462071012
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 12 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1012
状态: Active
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产品编号: 462071024
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1024
状态: Active
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产品编号: 462071104
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical, 4 Circuits, 2.36mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray
Engineering/Old PN: 46207-1104
状态: Active
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